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Your current location:Home » Product supply » 2 Parts Silicone Gel For Electronics
2 Parts Silicone Gel For Electronics
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Valid until: Long-term effective
Last updated: 2016-12-05 14:41

If you are planning to wholesale best cheap and high quality 2 parts silicone gel for electronics China, or hot sale 2 parts silicone gel for electronics in China from professional low stress gels for electronics, electrical insulating compound, electrical insulating materials, silicone electrical insulation manufacturers and suppliers and factory, please feel free to contact SEPNA, and welcome to check products price with us. Addition Type Insulation Silicone Gel SI2709 ◆Detailed Product Description SI2709A/B is transparent silicone gel, after cured it will be quite elastic material with buffer. It’s used to isolate moisture and other noxious pollutant from contacting the circuit board, also used to dielectric of high voltage. The other usage is stress relief for protecting circuit and contact device from high temperature and mechanical stress. Features? 1.1:1, addition type, strong adhesive force 2.Superior elasticity for stress relief 3.Quite low oil penetration after cured, good anti-poisoning 4.Good dielectric in high temperature, protect from high voltage 5.Excellent age resistance and weather resistance 6.Excellent waterproof, corrosion prevention, moisture proof and chemical media resistance Usage 1.Use in Optical Fiber Splice Closure, waterproof junction box and underwater instrument 2.Widely used in power electronics, ignition module and potting of IGBT ◆Data Table Properties?before?curing Part 2709A 2709B Component Polysiloxane Hydrogen?polysiloxane Appearance Transparent?liquid Transparent?liquid Viscosity,?mPa.s(25℃) 500 500 Density,?g/cm3(25℃) 0.99 0.99 Mixture/mass?ratio A:B?=?100:100 Viscosity?after?mixing,?mPa.s(25℃) 500 Operation?time?after?mixing,?min(25℃) 10?min Preliminary?curing?time,?min,25℃ 30mins Properties?after?curin Appearance Transparent?gel Penetration?degree?1/mm 90 Dielectric?strength,?KV/mm 25 Volume?resistance?DC500V,?Ω·cm 1.1×1014 Loss?factor(1?MHz) <0.001 Dielectric?constant?(1?MHz) 2.8 Application?temperature,?℃ -?60?∽?260 Note: ①All data above were tested under standardized condition. ②All data listed in the chart were for the generalized item in the series; please refer to the related data sheet for special items. ③Storage condition has a direct impact to the products’ shelf life, Please refer to the instruction for special items’ storing. ◆Operation Attention 1.Mix Part A and Part B by 1:1, pour directly into the protection needed component(or module). 2.Still the potted component to let it discharge the bubble. The curing time is about 4-5 hours at room temperature. It also can be heating cured, will need about 30 minutes at 80℃. ◆Notice 1.Vacuum defoamation can provide the property of cured product 2.The Mixed glue should be sealed after using 3.Low temperature will slow the curing speed, advice to heat curing 4.SI2709 will be hard to cure if contact with sulfur, amine or Sn ◆Package and Storage Package ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? Storage ? Part A: 10KG Bucket ? ? ? ? ? ? ? ?Shipped and stored as normal chemicals Part B: 10KG Bucket ? ? ? ? ? ? ? ?Shelf life: 12 months(25℃) ◆Safety Operation Material MSDS isn't included here. Please read TDS, MSDS and label carefully before operation.You can get MSDS from Sepuna or other distributors, or mail to service center, or call +86-400-882-1323. ◆Product Warranty All product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. Sepuna don't make assurance of any other applications outside the specification until Sepuna supply a special written guarantee. Sepuna is only responsible to replac or refund if this product is defective within the warranty period stated above. Sepuna makes it clear that will not be liable of any accidents.

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  • Updatetime
  • 25 Oct 2016 15:05

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