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Your current location:Home » Product supply » Fast Curing Structural Epoxy Adhesive
Fast Curing Structural Epoxy Adhesive
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Product: Views:3Fast Curing Structural Epoxy Adhesive 
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Last updated: 2016-12-05 14:41
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If you are planning to wholesale best cheap and high quality fast curing structural epoxy adhesive China, or hot sale fast curing structural epoxy adhesive in China from professional fast curing structural epoxy adhesive manufacturers and suppliers and factory, please feel free to contact SEPNA, and welcome to check products price with us.High Tensile Fast Curing Epoxy Adhesive SE2211◆Detailed Product DescriptionSE2211 is epoxy adhesive with high tensile and high curing speedFeatures1.Resistance of moisture, pollution and other atmospheric constituent?2.High tensile, excellent adhesive property3.Excellent pollution resistance, the demand of preprocess is low4.No solvent, no curing by-products5.Wonderful anti-temperature (-50℃~150℃)6.Excellent adhesive performance with fiberglass and metal sheet7.Have passed the UL certification?UseFor SMC FRP bonding, aluminum honeycomb pane splicing, transformer motor core bonding, Nomex paper bonding etc.◆Data TableProperties before curinPartABAppearanceBlack thick pasteOff-white thick pasteDensity, ?g/cm3(25℃)1.351.35Mixture/mass ratio, weight100:100Mixture/mass ratio, volume100:100Viscosity after mixing, mPa.s (25℃)ThixotropyDensity after mixing, ?g/cm3(25℃)1.35Operation time after mixing, min(25℃)10Preliminary curing time,℃/min60/20 or 25/70Properties after curingHardness, Shore D90Tensile-shear strength Mpa ,Al/Al17Heat conductivity, W/mK0.4Expansion parameterμm/(m,℃)44Water absorption 24h,25℃,%<0.3Dielectric strength, KV/mm,25℃>20Loss factor(1 MHz)0.014Dielectric constant (1 MHz)3.53Volume resistance DC500V, Ω·cm1.2×1015Note:①All data above were tested under standardized condition.②All data listed in the chart were for the generalized item in the series; please refer to the related data sheet for special items.③Storage condition has a direct impact to the products’ shelf life, Please refer to the instruction for special items’ storing◆Operation1. Buckets of A and B material is recommended to be stirred before using the components of A/B , ?A, B should be paid attention to seal preservation after using .2.Stirring should pay attention to the same direction, otherwise there will be mixed with too many air bubbles; Container frame and bottom of the rubber should also stir evenly, ?otherwise there will be a local not curing phenomenon caused by the mixing inequality ?3.The temperature is too low will cause the curing speed slow, when unable to reach initial strength , constant temperature control required on site.4.Cartridge packaging use midway need to keep the material mouth sealed.5.This curing process of adhesive is exothermic reaction , the adhesive quantity will affect the duration of operation, thus the operating time with 100 g adhesive is only a reference time.◆Package and StoragePackage ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? StoragePart A : 20kg/bucket , 310ml/cartridge ? ? ? ? Seal and Avoid light and lightPart B: 20kg/bucket or 310ml/cartridge ? ? ? Temperature≤25℃, humidity≤50%RHCustomized packaging ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? Shelf life: Part A 12months, Part B 12 months◆Safety Operation MaterialMSDS isn't included here. Please read TDS, MSDS and label carefully before operation.You can get MSDS from Sepuna or other distributors, or mail to service center sepuna@sepuna.cn, or call +86-400-882-1323.◆Product WarrantyAll product properties and application details based on information believe to be reliable and accurate. But you still need to test its property and safety before application. The advices we supply don't apply in any circumstances. Sepuna don't make assurance of any other applications outside the specification until Sepuna supply a special written guarantee. Sepuna is only responsible to replac or refund if this product is defective within the warranty period stated above. Sepuna makes it clear that will not be liable of any accidents.


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  • 25 Oct 2016 15:05
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